AI CHIPS ARE GETTING FASTER...AND MUCH HOTTER
POWER-HUNGRY AI IS A BIG CHALLENGE
In the coming years, a single server rack dedicated to advanced AI processing is expected to consume up to 600 kW of power; this is equivalent to the electricity usage of approximately 200 homes.
1x
= 200x
AI is transforming nearly every aspect of our lives, including how we consume and manage our energy resources. As demand grows, energy-efficient thermal management becomes not just important, but essential.
OUR CHIP-SCALE COOLING PLATFORM PERFORMS EVERYWHERE
1
Delivers 50% to 100% higher cooling performance than commercial solutions in ¼ of their size
2
Able to be optimized for virtually any chip configuration, in single or multi-die arrays
3
Can be built at scale with our proprietary tooling and optimized methods
4
Heat is removed at the die level and footprint (chip-scale), eliminating spreading resistance
5
Seamless integration with data center partner ecosystems and existing infraestructures
THERMAL INNOVATION THAT PAYS OFF
*Based on a 10 MW data center facility
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$2
$4
$6
$8
$10
$12
Annual Data Center Electricity Cost ($M)
$6.5M
$8.4M
$12M
Chip-Scale
Cooling
Cold-Plate/CDU
Cooling
Air Cooling
Our technology significantly reduces leakage currents by efficiently managing heat at the chip level. At the same time, it lowers system pumping requirements by achieving a lower pressure drop than state-of-the-art liquid cooling solutions. The result is substantial energy savings compared to both conventional and advanced systems on the market — accelerating not only hardware performance but also return on investment.
CONTACT US TO LEARN MORE
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